ThinkEdge SE30

Model	11NJ0002AUCompare
PERFORMANCE
Processor	Intel Core i3-1115GRE (2C / 4T, 1.7GHz, 6MB)
Graphics	Integrated Intel UHD Graphics
Chipset	Intel SoC Platform
Memory	1x 8GB Soldered DDR4-3200
Max Memory	Up to 16GB soldered memory, not upgradable
Memory Slots	Memory soldered to systemboard, no slots, dual-channel
Storage	256GB SSD M.2 2230 PCIe 3.0 NVMe
Storage Support	Up to two drives, 2x M.2 SSD • M.2 2280 SSD up to 2TB each • M.2 2230 SSD up to 1TB each • RAID 0/1 support
RAID Preset	None
Power Supply	65W 89% Adapter
DESIGN
Keyboard	USB Traditional Keyboard, Black, English
Mouse	USB Calliope Mouse, Black
Case Color	Black
Mounting	None
Dimensions (WxDxH)	• IO box \| 178 x 88 x 25.6 mm (7.01 x 3.46 x 1.00 inches) • ThinkEdge SE30 \| 179 x 88 x 51.5 mm (7.05 x 3.46 x 2.03 inches)
Weight	• IO box \| Around 0.499 kg (1.10 lbs) • ThinkEdge SE30 \| Around 1.02 kg (2.25 lbs)
CONNECTIVITY
Ethernet	Intel I225-IT + RTL8111KI, 2x RJ-45
WLAN + Bluetooth	Intel 9260, Wi-Fi 5, 802.11ac 2x2 + BT5.1
WWAN	Quectel EM160R-GL, 4G LTE CAT16
Front Ports	• 1x USB-C 3.2 Gen 2 (support data transfer and display) • 2x USB 3.2 Gen 2 • 1x headphone / microphone combo jack (3.5mm) • 2x serial (RS232 / RS422 / RS485, BIOS selectable)
Optional Front Ports (configured)	• 2x gigabit Ethernet (RJ-45) on SE30 IO box • 2x serial (RS232 / RS422 / RS485, SDK selectable) on SE30 IO box
Rear Ports	• 1x Thunderbolt 4 / USB4 40Gbps (support data transfer, Power Delivery 5V@3A and display) • 1x USB 3.2 Gen 2 • 1x HDMI 1.4b (for Celeron, i3 models) • 1x power connector • 2x Ethernet (RJ-45)
Optional Rear Ports (configured)	• 1x USB-C 3.2 Gen 1 on SE30 IO box, connect to SE30 • 1x DC-in 3pin Phoenix connector on SE30 IO box • 1x DIO (4DI / 4DO) on SE30 IO box
IO Box	IO Box
Monitor Cable	None
SECURITY & PRIVACY
Security Chip	Discrete TPM 2.0, TCG certified
Physical Locks	Kensington Security Slot, 3 x 7 mm
MANAGEABILITY
System Management	Non-vPro
SERVICE
Base Warranty	3-year, Onsite
Included Upgrade	None
ENVIRONMENTAL
Operating Temperature	Wide Temperature -20℃ to 60℃ (-4℉ to 140℉)
CERTIFICATIONS
Green Certifications	• ErP Lot 6/26 • Low Halogen • PCF • REACH • RoHS compliant • TED (ECO-declaration) • WEEE
SOFTWARE
Operating System	Windows 10 IoT Enterprise LTSC 2019, English
ACCESSORIES
Bundled Accessories	None
Model Information
Product	ThinkEdge SE30
Region	ANZ
Country/Region	Australia
Machine Type	11NJ
TopSeller	No
EAN / UPC / JAN	195890831039
End of Support	2027-11-26
Announce Date	2021-12-30

Performance

Processor

Processor Family

Intel® Celeron® or 11th Generation Intel® Core i3 / i5 Processor

Processor^**^[1]

Processor Name	Cores	Threads	Base Frequency	Cache	Memory Support	Processor Graphics
Celeron® 6305E^[2]	2	2	1.8GHz	4MB	DDR4-3200	Intel® UHD Graphics
Core i3-1115GRE^[3]	2	4	1.7GHz	6MB	DDR4-3200	Intel® UHD Graphics
Core i5-1145G7E^[4]	4	8	2.6GHz	8MB	DDR4-3200	Intel® Iris® Xe Graphics
Core i5-1145GRE^[5]	4	8	1.1GHz	8MB	DDR4-3200	Intel® Iris® Xe Graphics

Notes:

1. The Intel®® Turbo Boost is disabled. The maximum Thermal Design Power (TDP) of microprocessor might be 12W, 15W, or 28W, which depends on different microprocessor series. The max frequency might not be obtainable at high work levels, so the microprocessor will adjust the frequency to obtain the maximum TDP allowed.
2. The maximum Thermal Design Power (TDP) is 15W.
3, 5. The maximum Thermal Design Power (TDP) is 12W.
4. The maximum Thermal Design Power (TDP) is 28W.

Operating System

Operating System^**

Windows® 11 IoT Enterprise LTSC 2024
Windows® 10 IoT Enterprise LTSC 2019^[1]
Windows® 10 IoT Enterprise LTSC 2021
Ubuntu Core 20 64 Bit (kernel 5.13), Ubuntu (Server) 20.04 LTS 64 Bit (kernel 5.13)^[2]
Ubuntu Core 22 64 Bit (kernel 5.15), Ubuntu (Server) 22.04 LTS 64 Bit (kernel 5.15)^[3]
No preload operating system

Notes:

1. For SKU operational temperature range: -20~60°C; For no Qualcomm Snapdragon X55 5G models
2. For SKU operational temperature range: -20~60°C
3. For SKU operational temperature range: 0-50°C; For no WWAN models

Graphics

Graphics^**

Graphics	Type	Memory	Max Resolution	Connector	Key Features
Intel® UHD graphics	Integrated	Shared	3840x2160@30Hz(HDMI®), 3840x2160@60Hz(USB-C®), 3840x2160@60Hz(Thunderbolt™)	1x HDMI® 1.4b, 1x USB-C®, 1x Thunderbolt™	DirectX® 12
Intel® Iris® Xe Graphics	Integrated	Shared	3840x2160@60Hz(DP), 3840x2160@60Hz(USB-C®), 3840x2160@60Hz(Thunderbolt™)	1x DP 1.4a, 1x USB-C®, 1x Thunderbolt™	DirectX® 12

Monitor Support

Supports up to 3 independent displays via onboard ports (Celeron®, i3 models supports HDMI®, USB-C®, and Thunderbolt™; i5 models supports DisplayPort™, USB-C®, and Thunderbolt™)

Chipset

Intel® SoC (System on Chip) platform

Memory

Max Memory

Up to 16GB soldered memory, not upgradable

Memory Slots

Memory soldered to systemboard, no slots, dual-channel

Memory Type

DDR4-3200

Memory Protection^[1]

IB-ECC^[2]

Notes:

1. IB-ECC needs to be enabled in BIOS.
2. For SKU operational temperature range: -20~60°C

Storage

Storage Support^[1]

Up to two drives, 2x M.2 SSD • M.2 2280 SSD up to 2TB each • M.2 2230 SSD up to 1TB each • RAID 0/1 support

Storage Type^***

Disk Type	Interface	Security
M.2 2230 SSD	PCIe® NVMe®, PCIe® 3.0	-
M.2 2230 SSD	PCIe® NVMe®, PCIe® 3.0	Opal
M.2 2280 SSD^[2]	PCIe® NVMe®, PCIe® 4.0 x4	Opal 2.0
M.2 2280 SSD	PCIe® NVMe®, PCIe® 4.0 x4 Performance	Opal 2.0

RAID^[3]

RAID 0/1 support

Notes:

1. M.2 2280 SSD is for SKU operational temperature range: 0-50°C M.2 2230 SSD is for SKU operational temperature range: -20~60°C
2. For SKU operational temperature range: 0-50°C, M.2 PCIe Gen 4 SSD in a M.2 PCIe Gen 3 slot runs at PCIe Gen 3 speeds.
3. RAID preset is available via special bid, limited to the models with Windows® 10 IoT Enterprise.

Power Supply

Power Supply^**

Power	Type	Efficiency	Key Features	Dimensions
65W	Adapter	89%	100-240V	129 x 53 x 30 mm, 1800 mm cable
65W^[1]	Adapter	88%	100-240V	108 x 46 x 29 mm, 1800 mm cable
No power supply	-	-	-	-

Notes:

1. For SKU operational temperature range: 0-50°C. The power adaptor is EOL

Design

Input Device

Keyboard^**

Lenovo® Calliope Keyboard (USB connector), black
Lenovo® Calliope Wireless Keyboard, black
Lenovo® Traditional Keyboard (USB connector), black
No keyboard

Mouse^**

Lenovo® Calliope Mouse (USB connector), black
Lenovo® Fingerprint Mouse (USB connector), black (EOL on Jan, 2023)
No mouse

Mechanical

Dimensions (WxDxH)^[1]

Models	Dimensions
IO box	178 x 88 x 25.6 mm (7.01 x 3.46 x 1.00 inches)
ThinkEdge™ SE30	179 x 88 x 51.5 mm (7.05 x 3.46 x 2.03 inches)

Packaging Dimensions (WxDxH)^**

SE 30 (Mini package): 245 x 113 x 258 mm (9.65 x 4.45 x 10.16 inches)
SE 30 (Standard package): 491 x 153 x 264 mm (19.33 x 6.02 x 10.39 inches)

Weight^[2]

Models	Weight
IO box	Around 0.499 kg (1.10 lbs)
ThinkEdge™ SE30	Around 1.02 kg (2.25 lbs)

Packaging Weight^**^[3]

SE30 (Mini package): Around 1.65 kg (3.63 lbs)
SE30 (Standard package): Starting at 4.11 kg (9.06 lbs)

Case Color

Black

IO Box^[4]

ThinkEdge™ SE30 IO box: 2x serial (RS232 / RS422 / RS485) and 2x PoE (RJ-45) on front, 1x DIO (4DI / 4DO), USB-C® 3.2 Gen 1 (connect to SE30), and DC-in connector (9V - 36V) on rear^[5]
No IO box

Mounting^**

VESA mount bracket kit with adapter holder, supports VESA mount 75mm and 100mm
VESA mount bracket kit, supports VESA mount 75mm and 100mm
DIN rail mount bracket kit
Z hook
None

Notes:

1. The system dimensions may vary depending on configurations.
2. The system weight is approximate and based on results in Lenovo® lab, which varies depending on the source of component, variance of the distribution of each component, and manufacturing process. It may not be the exact weight for each specific model.
3. The packaging weight is varies depending on the selected accessories.
4. For more details, please go to https://pcsupport.lenovo.com.
5. Please refer to the Hardware Manual-ThinkEdge SE30 IO BOX for PoE power delivery requirements: https://download.lenovo.com/consumer/iot/thinkedge_se30_hsm_en.pdf

Connectivity

Network

Ethernet^**

Gigabit Ethernet (Realtek® RTL8111KI) and 2.5 Gigabit Ethernet (Intel® I225-V), 2x RJ-45, supports Wake-on-LAN^[1]
Gigabit Ethernet (Realtek® RTL8111KI) and 2.5 Gigabit Ethernet (Intel® I225-LM), 2x RJ-45, supports Wake-on-LAN^[2]
Gigabit Ethernet (Realtek® RTL8111KI) and 2.5 Gigabit Ethernet (Intel® I225-IT), 2x RJ-45, supports Wake-on-LAN^[3]

WLAN + Bluetooth^**^[4]

Intel® Wireless-AC 9260, Wi-Fi® 5, 802.11ac Dual Band 2x2 Wi-Fi® + Bluetooth® 5.1, Intel® vPro® technology support, M.2 card^[5]
Intel® Wireless-AC 9260, Wi-Fi® 5, 802.11ac Dual Band 2x2 Wi-Fi® + Bluetooth® 5.1, M.2 card^[6]
Intel® Wi-Fi® 6 AX201, 802.11ax 2x2 Wi-Fi® + Bluetooth® 5.1, Intel® vPro® technology support, M.2 Card^[7]
Intel® Wi-Fi® 6 AX201, 802.11ax 2x2 Wi-Fi® + Bluetooth® 5.1, M.2 Card^[8]
No WLAN and Bluetooth®

WWAN^**

Quectel EM160R-GL, 4G LTE CAT16
SDX55, 5G Sub-6^[9]
No support

Notes:

1, 8. For SKU operational temperature range: 0-50°C with Celeron processor
2, 7. For SKU operational temperature range: 0-50°C with i5 processor
3. For SKU operational temperature range: -20~60°C
4. Bluetooth® 5.2 is hardware ready but may run at a lower version due to OS limitations.
5. For SKU operational temperature range: -20~60°C with i5 processor
6. For SKU operational temperature range: -20~60°C with i3 processor
9. The 5G WWAN card is EOL

Ports^[1]^{Click here to see ports position}

Front Ports

1x USB-C® 3.2 Gen 2 (support data transfer and display)
2x USB 3.2 Gen 2
1x headphone / microphone combo jack (3.5mm)
2x serial (RS232 / RS422 / RS485, BIOS selectable)

Optional Front Ports^***

2x gigabit Ethernet (RJ-45) on SE30 IO box
2x serial (RS232 / RS422 / RS485, SDK selectable) on SE30 IO box

Rear Ports^[2]

1x Thunderbolt™ 4 / USB4® 40Gbps (support data transfer, Power Delivery 5V@3A and display)
1x USB 3.2 Gen 2
1x HDMI® 1.4b (for Celeron®, i3 models)
1x DisplayPort™ 1.4a (for i5 models)
1x power connector
2x Ethernet (RJ-45)

Optional Rear Ports^***

1x USB-C® 3.2 Gen 1 on SE30 IO box, connect to SE30
1x DC-in 3pin Phoenix connector on SE30 IO box
1x DIO (4DI / 4DO) on SE30 IO box

Notes:

1. The transfer speed of following ports will vary and, depending on many factors, such as the processing speed of the host device, file attributes and other factors related to system configuration and your operating environment, will be slower than theoretical speed. USB 2.0: 480 Mbit/s; USB 3.2 Gen 1 (SuperSpeed USB 5Gbps, formerly USB 3.0 / USB 3.1 Gen 1): 5 Gbit/s; USB 3.2 Gen 2 (SuperSpeed USB 10Gbps, formerly USB 3.1 Gen 2): 10 Gbit/s; USB4® 20Gbps / USB 3.2 Gen 2x2 (SuperSpeed USB 20Gbps): 20 Gbit/s; USB4® 40Gbps (USB 40Gbps): 40 Gbit/s; Thunderbolt™ 3/4: 40 Gbit/s.
2. If IO box gets power supply from ThinkEdge™ SE30, need to connect USB-C® (on IO box) with Thunderbolt™ 4 port (on SE30).

Security & Privacy

Security

Security Chip

Discrete TPM 2.0, TCG certified

Physical Locks

Kensington® Security Slot, 3 x 7 mm

Chassis Intrusion Switch

Chassis intrusion switch

BIOS Security

Self-healing BIOS
Self-healing BIOS (EC-based)

Manageability

System Management

Intel® vPro® with Intel® AMT 15
Non-vPro®

Service

Warranty^[1]

Base Warranty^**

1-year courier or carry-in service
1-year limited onsite service
3-year limited onsite service
No base warranty

Notes:

1. The warranty upgrades may be bundled with some models, please check the "Included upgrade" column in the specific model's configurations. For more service extensions, please go to https://smartfind.lenovo.com/. To learn more details of warranty policy, please access https://support.lenovo.com/warrantylookup/warrantypolicy.

Accessories

Bundled Accessories

DP to Dual DP (MST) dongle
DP to Dual DP (SST) dongle
DP to HDMI® dongle
DP to VGA dongle
USB-C® to DP dongle
USB-C® to HDMI® dongle
USB-C® to VGA dongle
None

Operating Requirements

Operating Environment^[1]

Temperature

Operating: IEC60068-2-1 Test A: Cold, IEC 60068-2-2 Test B: Dry heat, -20°C (-4°F) to 60°C (140°F) with 0.7m/s air flow^[2]
Operating: IEC60068-2-1 Test A: Cold, IEC 60068-2-2 Test B: Dry heat, 0°C (32°F) to 50°C (122°F) with 0.7m/s air flow^[3]
Storage: IEC60068-2-1 Test A: Cold, IEC 60068-2-2 Test B: Dry heat, -40°C (-40°F) to 85°C (185°F)

Relative Humidity

Relative humidity operating: IEC 60068-2-66 Damp heat, steady state 95%@40°C non-condensing
Relative humidity storage: IEC 60068-2-66 Damp heat, steady state 90%@60°C

Shock Protection

IEC 60068-2-27, shock, operating, 30G / 11ms, half sine

Vibration Protection

IEC 60068-2-64, Vibration, Operating, 3Grms, random, 5 ~ 500Hz, 1hr/axis

Notes:

1. The temperature spec is not applicable for hardware accessories.
2. models include: 11NA, 11NB, 11NC, 11NJ
3. models include: 11NK, 11NH

Certifications

Green Certifications

ErP Lot 6/26
Low Halogen
PCF
REACH
RoHS compliant
TED (ECO-declaration)
WEEE

Other Certifications

EMC

EMC CE / FCC Class B
BSMI
CCC

Safety

UL(ETL)
BSMI
CB
CCC

Mil-Spec Test

MIL-STD-810H military test passed

Feature with ** means that only one option listed under the feature can be configured on selected models. Please refer to the model configuration for specific information.
Feature with *** means that one or more options listed under the feature can be configured on selected models. Please refer to the model configuration for specific information.
Lenovo reserves the right to change specifications or other product information without notice. Lenovo is not responsible for photographic or typographical errors. LENOVO PROVIDES THIS PUBLICATION "AS IS," WITHOUT WARRANTY OF ANY KIND, EITHER EXPRESS OR IMPLIED, INCLUDING THE IMPLIED WARRANTIES OF MERCHANTABILITY OR FITNESS FOR A PARTICULAR PURPOSE. Some jurisdictions do not allow disclaimer of express or implied warranties in certain transactions, therefore this disclaimer may not apply to you.
The specifications on this page may not be available in all regions, and may be changed or updated without notice.

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	Up to 11th Gen Intel® Core™ i5-1145G7E
	Up to Windows® 11 IoT Enterprise LTSC 2024
	Up to 16GB DDR4-3200, soldered
	Up to 2x 2TB M.2 2280 PCIe® NVMe® SSD, RAID 0/1 support

1. Power connector	8. Power button
2. HDMI® (for Celeron®, i3) / DisplayPort™ (for i5)	9. Serial
3. USB 3.2 Gen 2	10. Serial
4. Thunderbolt™ 4	11. USB-C® 3.2 Gen 2
5. Ethernet (RJ-45)	12. USB 3.2 Gen 2
6. Ethernet (RJ-45)	13. USB 3.2 Gen 2
7. Kensington® Security Slot™	14. Headphone / microphone combo jack (3.5mm)

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